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Automatics

Horizontal/vertical type plating machines

Accessories

The AUTO PRO series have been developed in consideration of various demands of customers. Semifinished products (units) by the lot production are completed by adding functions according to the user specifications. Therefore, any models can be delivered quickly as long as the system is structured with the standard units. Various optional units are also available to provide the customers with the specific functions they require.

	Features

Precision/stability
・	High analysis precision and stability can be obtained by the use of a high throughput CPU. (Average error: ±3%)

High speed analysis
・	The analysis time can be reduced by the high-speed and high torque metering pumps. (The analysis of the concentrations of alkali, copper, and formalin, and pH of electroless copper plating bath can be done at a minimum speed of 15 minutes.).

Easy operation
・	The operation is very easy and can be done without referring to the instruction manual.

Easy maintenance
・	Devices are so positioned that all the maintenance operations may be carried out in the front of the system.

Applicability in overseas
・	Using the dedicated transformer, it can be used at different voltages in the major cities of the world

Extendability
・	The concentration signal generated by the system can be used as the control signal of other devices.

	・	One system can analyze up to 4 basic components.
	・	Four external signals can be outputted for each analysis item. [Extreme upper limit/Upper limit/Lower limit (supply)/Extreme lower limit]
	・	Supply methods may be selected from among many options. [The timer control or the pulse control. The proportional supply or the proportional cumulative supply.]
	・	Samples are taken directly from the bath.
		Outside dimensions of the system

	AUTO PRO Light series block diagram

	Applicable processes of the AUTO PRO Cute series

Model	Process	Items of analysis
SA	Acidic-/ electro-cleaning	(1) Free acid, including acid concentration
SH	Degreasing	(1) Free alkali, including NaOH
ZC/A	Zincate A	（1）NaOH　（2）Zn²⁺
ZC/B	Zincate B	（1）NaOH　（2）H₂CO₃　（3）Zn²⁺
EL-Cu/PTH	Electroless Cu plating	（1）NaOH　（2）HCHO　（3）Cu²⁺　（4）pH
EL-Ni/P	Electroless Ni plating for industrial use	（1）pH　（2）Ni²⁺
EL-Ni/A	Electroless Ni plating for plastics	（1）pH　（2）Ni²⁺
A-66	Accelerator	（1）PC-66H
MAB	Reduction (weak acid)	(1) MAB-4B (acid) 　(2) MAB-4B (reducing agent)
N-PC	Neutralization reduction	（1）H₂SO₄　（2）H₂O₂　（3）Cu²⁺
M-SPS	Microetching	（1）H₂SO₄　 (2) SPS (persulfate) 　（3）Cu²⁺
PB-300	Catalyzing	（1）Pd²⁺　（2）Cu²⁺
HS	Solder plating	(1) Organic acid　（2）Sn²⁺
Cu/CN	Copper cyanide plating	（1）NaOH　（2）CN^-　（3）Cu²⁺
Ag/CN	Silver cyanide plating	（1）NaOH　（2）CN^-
DG1	Desmearing/degreasing	(1) Alkalinity　（2）Cu²⁺
ET1	Desmearing/PI etching	(1) Alkalinity　 (2) Permanganic acid　(3) Manganic acid
RD1	Desmearing/neutralization reduction	（1）pH　(2) DS-310 (Reducing agent)
DG2	DPS microetching	(1) Alkalinity　(2) Concentration of copper impurities
MC1	DPS microetching	(1) Persulfate　(2) Sulfuric acid（(3) Concentration of copper impurities
AC1	DPS activator	（1）Pd²⁺（2）Sn²⁺　(3) Concentration of copper impurities
MT1	DPS metallizer	(1) pH　(2) Alkalinity 　(3) Copper concentration
SB1	DPS stabilizer	(1) Acid concentration　(2) Concentration of copper impurities

Note: Before use, a preliminary test of the system with the actual process to be analyzed should be performed to ensure the performance. Model names are subject to change.

Up to 5 supply pumps can be installed.
* We can investigate the plating processes and analysis items that are not on the above list. Please consult us.

	・	One system can analyze up to 2 basic components.
	・	A single external signal can be outputted for each analysis item. [Lower limit (supply)]
	・	Supply can be done as an option. [Constant amount of supply by the timer control]
	・	Samples are taken directly from the bath.
		Outside dimensions of the system

	AUTO PRO Light series block diagram

	Applicable processes of the AUTO PRO Light series

Model	Process	Items of analysis
LPH	Baths that require pH control, including the electroless Ni plating bath	Continuous pH measurement
LNI	Ni control of electroless Ni plating bath	Continuous Ni measurement
LSA	Pre-treatment bath, etching bath 　Composition control of the dry film bath for PWBs	Acid and alkali concentrations based on neutralization titration
LCU	Copper concentration control of soft etching and electroless copper plating baths	Copper
LHC	Formalin concentration control of electroless copper plating bath	Formalin
LH2	Concentration control of hydrogen peroxide for etching bath	Hydrogen peroxide solution
LME	Concentration control of metallic iimpurities for zincate 　and neutralization baths	Metal ions
LZC	Concentration control of the zincate bath	（1）NaOH　（2）Zn²⁺
* Model names are subject to change. * Other analysis items may be added from time to time.

Note: Before use, a preliminary test of the system with the actual process to be analyzed should be performed to ensure the performance.

Up to 2 supply pumps can be installed.
* We can investigate the plating processes and analysis items that are not on the above list

Accessories

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