HOME > Products > Electronics-related plating    Back to Products top    Chemicals for printed-wiring boards   Chemicals for electronic parts    Chemicals for plating semiconductor wafers    Chemicals for plating for electromagnetic interference (EMI) shielding - Plating technology supporting electronics - We have responded to the manufacturing technology of the more detailed and higher density semiconductor packages and printed-wiring bo ards, which are necessary for the increasingly accelerated advanced performance and reduced size of electronics. We are also environmentally conscious. We develop and provide products with the keywords of "next-generation processes" and "environmentally-friendly". Along with the downsizing of devices, finer circuits on the printed wiring boards, where electronic parts are installed, are increasingly required. We meet such requirement through the development of new processes and proposal of the total system of machine and chemicals.   Electroless copper plating with horizontal machine De-smear process   Electroless copper plating process Pd-Sn-based direct plating Process for manufacture of double layer CCL polyimide laminate High leveling process   Process for PWBs with through holes and vias of high aspect ratio Nickel plating process Solder plating process   Electroless nickel process for the undercoat of displacement gold plating Acid degreasing agent Discoloration preventing agent   Rack stripper Bridge prevention process for electroless Ni-Au plating Electroless copper plating system for build-up PWBs   Acid copper plating process for via-filling Process for TAB, COF, various kinds of base materials Etching process for double layer CCL Various kinds of solder plating are applied to electronic parts, including IC lead frames, chip resistors, chip capacitors, and connectors, for electrical connection. As these parts get smaller, we provide processes that meet their requirements. Alkaline cleaner Neutral cleaner   Acid cleaner Electrolytic cleaner Etching agent for 42-alloy Halogen-free etching agent for copper   Electrolytic etching agent for copper alloy   Semi-bright solder plating process for barrels   Semi-brght solder plating process for high speed   Bright solder plating process for barrel operation   Brightsolder plating process for high speed   Whisker-free pure Sn plating process   Whisker-suppressed pure Sn process for IC lead frames Immersion type rack stripper Electrolytic type rack stripper   Rack stripper for various types of Pb-free Sn alloy plating Pb-free alloy plating process Neutral Sn plating process Even in the field of semiconductors, for which extremely fine connections are required, the wet process (plating technology) has been adopted more and more recently instead of the dry process, such as PVD and CVD. As the plating process for semiconductor wafers, we have chemicals for copper plating for the Damascene process for very fine interconnections, as well as various kinds of chemicals for copper plating for bumps, nickel plating, solder plating, and gold plating.   Various kinds of bump plating systems (copper, nickel, solder, and gold.)Copper plating system for the Damascene process for very fine interconnections   Our plating technology is also utilized to protect electronics, such as computers, from electromagnetic interference which causes malfunction.   Electroless plating system for EMI shielding Plating process for fabric for EMI shielding