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Our Whisker Buster Process is a new process that is equivalent to the conventional Sn-Pb bath in terms of whisker suppression effect. It is a total process including the pretreatment, pure Sn plating, and post-treatment stages and assures stable levels of whisker suppression effect and solderability.
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| 1. |
Improves whisker suppression effect without undercoating or annealing after plating. |
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| 2. |
Allows the use of present facilities without modification. |
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| 3. |
Provides solderability that is comparable to and assures ease in secondary processing like the conventional Sn-Pb bath. |
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| 4. |
Allows easy bath control. |
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| 5. |
Allows cost reduction in comparison with the Sn alloy plating. |
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Whisker suppression effect |
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Plating Cycle and Purpose |
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Step |
Name of process |
Purpose |
| Electrolytic degreasing |
WB-200 |
Uniformity in etching. |
| Etching |
WB-300 |
Removal of the layer changed by processing and oxide film (drop in stress). |
| Pre-dip |
EBASOLDER A |
Improvement of initial deposition performance. |
| Sn plating |
WB-500、WB-500HD |
Control of grain size, drop in stress. |
| Post-treatment |
WB-900 |
Inhibition of oxidation of plated film.
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Chemicals for electronic parts
