HOME > Products > Electronics-related plating > Chemicals for printed-wiring boards：Etching process for double layer CCL    Back to Products top    Chemicals for printed-wiring boards   Chemicals for electronic parts    Chemicals for plating semiconductor wafers    Chemicals for plating for electromagnetic interference (EMI) shielding The SEEDLON process removes the Ni-Cr alloy seed layer that raises a problem in the formation of adhesiveless CCL by sputtering. Features 1.　 Cyanide-free, low hydrochloride type process. 2.　 After forming circuits, it removes the Ni-Cr alloy seed layer remaining on the substrate quickly and completely. 3.　 Scarcely etches the copper circuits. 4.　 The performance can be maintained stably for a long time. Effect of the SEEDLON process Change in etching rate in continuous use Chemicals for printed-wiring boards Process for PWBs with through holes and vias of high aspect ratio　|　 Electroless nickel process for the undercoat of displacement gold plating ｜ Bridge prevention process for electroless Ni-Au plating　|　 Electroless copper plating system for build-up PWBs　｜ Acid copper plating process for via-filling 　|　 Process for TAB, COF, various kinds of base materials ｜ Etching process for double layer CCL　|