|
|
 |
 |
As an effort of not using Pb, the process applied to chip electronic parts is changing from soldering process to tin process. In order to improve the precision of performance and reduce costs, change in firing temperature and some part of protective material to resin is underway. Such change calls for switching of the bath to neutral type in view of the level of chemical proof of the parts and the way of switching has been studied for some time. On the other hand, with regard to the size of chip parts, 0603 is becoming the mainstream for portable devices. However, 0402 products have been introduced on the market, and with the minimization, coupling of the parts and aggregation of dummy parts have become obvious problems.
In order to solve these problems, we have developed the neutral tin plating process"EBASOLDER NTR"which is suited for chip resistors and the"EBASOLDER NTI"for chip inductors and capacitors.
|
 |
Compared to the proven EBASOLDER NT process, the EBASOLDER NTR can inhibit both so-called coupling of parts, sticking of parts to each other, in barrel plating and aggregation of microscopic dummy parts placed in the barrel.
Chip inductors and chip capacitors are quite likely to be plated not only on the electrodes but also over the substrate because of the characteristic of the substrate material.The EBASOLDER NTI is capable of suppressing this "spreading"as much as possible. |
|
Chemicals for electronic parts
