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In the aim of avoiding the use of lead in view of environmental concerns, we have the Sn-Ag alloy plating process (EBASOLDER SE II) as Pb-free plating process to replace the traditional Sn-Pb plating process.
Since it is a bath based on alkansulfonic acid , which is widely used for the traditional Sn-Pb bath, the plating conditions and equipment can be used without modification.
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| 1. |
Organic acid-based plating bath and contains no chelating agent, which causes problem in wastewater treatment. |
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| 2. |
Excellent solderability and covering power. |
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It can be used for a wide range of current density, from low to high. |
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Good uniformity in film composition. |
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Because the film has high ductility, less cracks occur upon lead forming, etc. |
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Among the Sn alloy plating processes, the Sn-Cu process is most likely to form whiskers and the Sn-Ag process is the best |
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Optimum operating conditions |
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EBASOLDER SE II process (Sn-Ag alloy plating) |
Item |
Conditions |
| Make-up concentrations |
EBASOLDER SN |
300 g/L |
| EBASOLDER AG |
12mL/L |
| EBASOLDER A |
160 g/L |
| EBASOLDER SE II A |
50mL/L |
| EBASOLDER SE II B |
100mL/L |
Concentrations for
control |
Sn |
30 g/L |
| Ag |
1.2 g/L |
| EBASOLDER A |
200 g/L |
| EBASOLDER SE II A |
50mL/L |
| EBASOLDER SE II B |
100mL/L |
| Operating conditions |
Bath temperature |
20℃-35℃ |
| Cathode current density |
5-30A/dm2 |
| Anode |
Sn (100%) anode |
| Filtration |
Continuous filtration with filter mesh of 5 μm or less |
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Chemicals for electronic parts
