HOME > Products > Electronics-related plating > Chemicals for electronic parts：Etching agent for 42-alloy    Back to Products top    Chemicals for printed-wiring boards   Chemicals for electronic parts    Chemicals for plating semiconductor wafers    Chemicals for plating for electromagnetic interference (EMI) shielding The IC-313N is an etching agent for lead frames of 42-alloy and electronics parts that does not contain halogen like fluoride and hydrogen peroxide. Because fluoride is not used, it does not corrode the SUS material. Features 1.　 Because it does not contain fluoride or hydrogen peroxide, the bath is stable and allows simple wastewater treatment. 2.　 The etching rate is stable even in continuous use. 3.　 Because it does not attack stainless steel, it does not damage racks or contact points. 4.　 Unlike the fluoride-based process that forms sludge, it forms none and thus allows easy maintenance. The etching rate is stable even when the metal concentration in the bath has increased. Solubility of stainless steel 　Process 　Type of stainless steel 　Immersion time 48 hrs 　144 hrs 　196 hrs 　IC-313N 　SUS-304 　0 　0 　0 　SUS-316 　0 　0 　0 　Fluoride & hydrogen peroxide-based process 　SUS-304 　1.15 　2.05 　4.23 　SUS-316 　1.15 　1.67 　3.21 (Unit: μm) Chemicals for electronic parts Etching agent for 42-alloy　|　Electrolytic etching agent for copper alloy　| Whisker-free pure Sn plating process　|　Whisker-suppressed pure Sn process for IC lead frames　| Pb-free alloy plating process　|　Neutral Sn plating process　|