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HOME > Products > Electronics-related plating > Chemicals for printed-wiring boards：Process for TAB, COF, various kinds of base materials
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Decorative, functional, rust-proof, Plating on Plastics
Electronics-related plating

  		 Chemicals for printed-wiring boards

  Chemicals for electronic parts

  		 Chemicals for plating semiconductor wafers

  		 Chemicals for plating for electromagnetic interference (EMI) shielding
Surface treatment machines
Electronics-related plating

Process for TAB, COF, and various kinds of base materials

The LIZATRON DPS process is best suited for plating small diameter BVHs and through holes by the reel-to-reel method. By combining with the high-performance acid copper plating process like our CU-BRITE TH-R II, a highly reliable quality may be obtained.

Process flow



Plating processes (after desmearing)



Features
1.　 Pd-Sn conductive film that is close to metal in terms of ionic valency. Low electric resistance.
2.　 Electric resistance values of LIZATRON DPS process.
After activator
After metallizer
After stabilizer
∞
100 - 500Ω
1 - 500Ω

3.　 No gas is produced by reaction. Inside BVHs is void-free.
4.　 High reliability of adhesion with the insulating resin.


5.　 Stress control by controlling the additive concentration.


6.　 Good bright appearance even with a thin film of 3 - 5 μm.



Chemicals for printed-wiring boards

Process for PWBs with through holes and vias of high aspect ratio　|　
Electroless nickel process for the undercoat of displacement gold plating ｜
Bridge prevention process for electroless Ni-Au plating　|　
Electroless copper plating system for build-up PWBs　｜ Acid copper plating process for via-filling 　|　
Process for TAB, COF, various kinds of base materials ｜ Etching process for double layer CCL　|
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