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CU-BRITE VF process
The CU-BRITE VF process is a bright acid copper plating process developed for forming fine interconnections and via filling of buildup PWBs and is applicable to both pattern and panel plating.
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| Excellent filling performance of via holes (best suited for the panel plating). |
| Excellent throwing power in through holes. |
| Excellent via-filling performance in pattern plating for PWBs with via holes of small diameter and excellent uniformity in film thickness in both densely and sparsely patterned areas. |
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Sparse (μm) |
Dense (μm) |
Dense/sparse |
| VFⅢ |
20.1 |
17.8 |
0.89 |
| VFⅡ |
25.7 |
17.8 |
0.69 |
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