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PB-556
The number of materials that have difficulty in being plated has been increasing recently, due to downsizing of fine interconnections on build-up PWBs for semiconductor packages, higher glass transient temperature (Tg) required for the PWBs, and the use of environmentally-friendly, halogen-free insulating materials. Our PB-556 is the electroless copper plating process for build-up PWBs and package boards with highly dense interconnections in consideration of the environmental issues (halogen-free, cyanide-free, etc.).
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Well cope with features with fine irregularity for copper deposits preferentially over palladium in comparison with the case of deposition over copper. |
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| 2. |
Demonstrates excellent covering power in via and through holes of high aspect ratio and excellent adhesion to insulating resin. |
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Being a cyanide-free process, it is a next generation electroless copper plating process that allows simple wastewater treatment and in view of environmental protection. |
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Has good solution stability in spite of being of cyanide-free. |
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Simple product composition allows easy solution control including make-up and analysis. |
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