HOME > Products > Electronics-related plating > Chemicals for printed-wiring boards：Bridge prevention process for electroless Ni-Au plating    Back to Products top    Chemicals for printed-wiring boards   Chemicals for electronic parts    Chemicals for plating semiconductor wafers    Chemicals for plating for electromagnetic interference (EMI) shielding FINELISE Process This process is to prevent bridges that occur upon the electroless Ni plating on the outermost layer of PWBs. It can be used for the ultra fine interconnections of L/S=20/20 μｍ or less. Features 1.　 Bridges between fine lines are prevented. 2.　 Treatment is carried out in 2 stages, namely, Pd removal and prevention of deposition. 3.　 Hazardous substances such as cyanogen and chromium are not included. 4.　 Scarcely etches copper lines. 5.　 The stable performance can be maintained for a long time. 6.　 It can be used either by spraying or immersion. Treatment cycle of the FINELISE Process After the bridge prevention treatment with this process, workpiecs are to be subjected to the normal plating cycle. Chemicals for printed-wiring boards Process for PWBs with through holes and vias of high aspect ratio　|　 Electroless nickel process for the undercoat of displacement gold plating ｜ Bridge prevention process for electroless Ni-Au plating　|　 Electroless copper plating system for build-up PWBs　｜ Acid copper plating process for via-filling 　|　 Process for TAB, COF, various kinds of base materials ｜ Etching process for double layer CCL　|