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ENIAUR M Process
Electroless Ni/Au, which is used for bumps and PWBs, requires good solder joint characteristic. One of the factors that affect the solder joint strength is the corrosion behavior of the electroless Ni film. Because the electroless Au plating on the electroless Ni is displacement plating, the Au film is formed while the Ni film is dissolved (corroded). If the Ni film is easily corroded, the solder joint strength is quite likely to be adversely affected. With the newly developed electroless Ni process "ENIAUR M,"the corrosion of Ni film remains to be a small amount , which is the feature of note, and subsequently assure good solder joint characteristic.
In combination with our bridge prevention process "FINELISE," it can be used for the high density PWBs at ease.Further, it is an environmentally-friendly process because it does not contain any regulated substance like boron and lead.
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With a little corrosion, good solder joint strength can be obtained. |
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Regulated substances, such as boron and lead, are not included. |
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The deposition rate and phosphorus content (approx. 10%) remain stable. |
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Good corrosion resistance is proven by sulfur dioxide corrosion test. |
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SEM pictures of electrolessly plated Ni film (After Au film has been peeled off) |
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Solder joint characteristics |
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| Type of Ni plating solution |
Thickness of
Au film |
Solder ball shear test |
Normal temperature ball pulling test |
| Good mode rate |
Pull strength |
Good mode rate |
General process
Phosphorus content: 7% |
0.06 µm |
80％ |
2977g |
30％ |
ENIAUR M
Phosphorus content: 10% |
0.06 µm |
100％ |
3290g |
100％ |
| Solder ball: Sn/Pb; Solder ball diameter: 0.76 mm |
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Deposition rate of ENIAUR M Process and phosphorus content |
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