HOME > Products > Electronics-related plating > Chemicals for printed-wiring boards：Process for PWBs with through holes and vias of high aspect ratio    Back to Products top    Chemicals for printed-wiring boards   Chemicals for electronic parts    Chemicals for plating semiconductor wafers    Chemicals for plating for electromagnetic interference (EMI) shielding The CU-BRITE 21 Process offers excellent throwing power in through holes and vias of high aspect ratio. It also succeeded in eliminating the large amount of anode slime, a weak point of the bath of ultra high throwing power. Features 1.　 Excellent throwing power. Compared to the traditional bath of high throwing power, it is better by 10-20% 2.　 The film has good ductility and excellent to thermal shock resistance. 3.　 Easy to use thanks to simple bath control. 4.　 The anode maintenance operation can be reduced because of small amount of anode slime formed. Chemicals for printed-wiring boards Process for PWBs with through holes and vias of high aspect ratio　|　 Electroless nickel process for the undercoat of displacement gold plating ｜ Bridge prevention process for electroless Ni-Au plating　|　 Electroless copper plating system for build-up PWBs　｜ Acid copper plating process for via-filling 　|　 Process for TAB, COF, various kinds of base materials ｜ Etching process for double layer CCL　|