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The decorative acid copper plating process, CU-BRITE EP-30, provides excellent brightness/leveling from the high current area to the low current area. It also secures the necessary plating thickness in a short period of time because it does not cause burns even with increases of 30% to 50% in the usual current. Because this process can be used at a high bath temperature of approximately 40℃, the burden on the cooling system is reduced and the energy cost is cut significantly. In addition, the problem of increase in the volume of plating solution due to the temperature difference between the plating bath and the open air in summer is reduced.
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| Items |
Range, Conditions |
| Cathode current density (A/dm2) |
1 - 6 |
| Anode current density (A/dm2) |
1 - 3 |
| Bath temperature (℃) |
20 - 40 |
| Agitation |
Vigorous air agitation |
| Filtration |
Continuous filtration without activated carbon |
| Anode |
Phosphorized copper anode |
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Physical properties of film (after annealing) |
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| Elongation (%) |
Tensile strength (kg.f/mm2) |
Hardness (Hv) |
Room temperature,
2 hrs |
150℃,
2 hrs |
Room temperature,
2 hrs |
150℃,
2 hrs |
Room temperature,
2 hrs |
150℃,
2 hrs |
| 7.5 |
14.4 |
72.2 |
35.5 |
198 |
120 |

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